The IVS 380 is an optical overlay, CD & z-height metrology system designed for high volume manufacturing, with SMIF (200mm substrate) or FOUP (300mm substrate) load ports compatibility. It handles various substrates for advanced packaging, including Si, glass and CCL, and accommodates sizes of 200mm and 300mm.

Building on the IVS family’s 40 years of experience in CMOS, MEMS and compound semiconductor applications, the IVS 380 system possesses the versatility to tackle overlay, CD and z-height measurements for diverse substrates and layers. It measures critical dimensions in the xy plane and the vertical z-heights of features like RDL metal lines, posts and bumps. The optics enable focus on mostly transparent materials such as photoresists and rough surfaces such as electroplated copper.

The Iris S system delivers films metrology and advanced OCD capabilities for the specialty and advanced packaging segments. With a small footprint, it handles 150mm, 200mm, and 300mm wafer sizes, including thin, thick and bonded wafers. The system supports various materials such as Si, SiC, GaN and glass, addressing device-level challenges impacting performance and yield. Leveraging Onto’s Ai Diffract^™ software, the Iris S system supports the most difficult on-wafer high value problems.

The Iris S system includes a dual-arm robot, high-precision stage, advanced pattern recognition, and high-speed focus for accurate positioning at high throughput. The dual channel optical architecture offers oblique incidence Mueller Matrix spectroscopic ellipsometry (MMSE) and normal incidence spectroscopic reflectometry (SR) in a broad wavelength range from UV to IR.

Based on Windows 10 OS and a 64-bit architecture, the Ai Diffract™ software interface and automation comply with SEMI standards. Onto’s model guided machine learning enables fast, flexible and robust film and OCD recipe setup.

The Echo system is a comprehensive in-line metal film metrology tool designed for single and multi-layer metal film measurements in leading-edge logic, memory, advanced packaging and specialty semiconductor devices. Its innovative optics design extends the dynamic range for film thickness measurement from 50Å to 35µm on a single platform and offers extendibility to measure high aspect ratio advanced 3D NAND structures. The Expert Applications System (EASy™) software provides flexibility for developing user-defined algorithms to model complex multi-layer stacks.

The Echo system’s capabilities have been extended to include materials characterization. In addition to measuring the Young’s Modulus of low-k dielectric films in BEOL and amorphous carbon hard masks in 3D NAND, the Echo system includes proprietary electronics and algorithms for implant monitoring and thermal conductivity characterization. Its small spot size, combined with rapid measurements, enables full wafer mapping capabilities with 0.5mm edge exclusion, improving time to yield.

The Atlas III+ system is a widely adopted inline OCD metrology system, known for its robust and reliable solutions across all OCD and film layers from FEOL to BEOL. With its information-rich optical architecture, powerful OCD and machine learning analysis engine, the Atlas III+ system excels in advanced logic, 3D NAND and DRAM device processes. Extending metrology performance to sub-angstrom precision and accuracy levels, this system enables advanced process control across a broad range of applications in high volume manufacturing. The Atlas III+ system incorporates a proprietary spectroscopic reflectometry and spectroscopic ellipsometry solution, and when combined with Onto Innovation’s Ai Diffract™ OCD analysis software, it enables process control of every critical manufacturing unit operation. Users can gain insights into complex structure profiles across etch, clean, deposition and CMP steps.

The NSX 330 system features robust platform technology with high-acceleration staging, high-speed multi-processor computing and flexible software. With over 1,000 installation worldwide, the NSX 330 System offers 2D inspection and metrology at high throughput and a broad portfolio of 3D sensors supporting critical advanced packaging applications. These include wafer-level metrology for micro bumps, RDL, kerf, overlay, and through silicon via (TSV) in a single wafer load.

Accommodating wafers from 100mm to 330mm, the system features a versatile objective turret, programmable light tower, and multiple dark field illumination modes. Additional features include resolution flexibility, unique handling solutions, and comprehensive software for recipe sharing and offline analysis. The NSX 330 system, with optional edge and backside inspection via the EB40 module, provides a comprehensive all-surface inspection solution packaging technology challenges.

The F30 automated defect inspection system combines high resolution and throughput to drive fab yield and productivity. A five-objective turret enables resolution-throughput flexibility, while its multi-channel illumination including brightfield, darkfield, high-angle ring light, and IR-Review addresses the requirements for today’s multi-process inspection applications. Equipped with an advanced productivity suite (waferless recipe creation, simultaneous FOUP, recipe server and tool matching), the F30 System redefines inspection cost of ownership expectations. The system can handle 100mm – 300mm wafers can be paired with the edge and backside module (EB40) to provide an all-surface inspection solution.