Learn how to reduce stress that causes warpage, how HBM architectures will need to change, and what happens when hybrid bonding and co-packaged optics are added into these devices from Onto Innovation's topical video with Semiconductor Engineering.
The Atlas III+ system provides dependable OCD and thin film metrology for established technologies, with flexible performance across a wide range of process layers and device types.
The Atlas III+ system is a widely adopted inline OCD metrology system, known for its robust and reliable solutions across all OCD and film layers from FEOL to BEOL. With its information-rich optical architecture, powerful OCD and machine learning analysis engine, the Atlas III+ system excels in advanced logic, 3D NAND and DRAM device processes. Extending metrology performance to sub-angstrom precision and accuracy levels, this system enables advanced process control across a broad range of applications in high volume manufacturing. The Atlas III+ system incorporates a proprietary spectroscopic reflectometry and spectroscopic ellipsometry solution, and when combined with Onto Innovation’s Ai Diffract™ OCD analysis software, it enables process control of every critical manufacturing unit operation. Users can gain insights into complex structure profiles across etch, clean, deposition and CMP steps.
Enhance CMP process control with a connected metrology approach that feeds forward data from standalone OCD or films metrology to integrated metrology, connected through AI-driven analytical software. This approach, powered by advanced modeling and analysis tools, can deliver high-precision, high-throughput results—minimizing or eliminating the need for and cost of new TEM data and enabling accelerated time to solution, faster excursion detection, reduced cost and improved Cpk.
As semiconductor manufacturers push the boundaries of performance and functionality—driven by high-performance computing and AI applications—chemical mechanical planarization (CMP) processes increase in intensity complexity. New logic transistor designs, 3D NAND stacking, and DRAM integration introduce more CMP layers and tighter process windows.
The IMPULSE V system helps to advance CMP processing with enhanced wavefront technology and AI-driven analytics, delivering over 2X precision improvement and faster solutions, crucial for next-gen semiconductor manufacturing demands.
The IMPULSE+ system is designed to deliver film measurement, fidelity and productivity in the CMP process module. Available as an integrated or standalone platform, it offers high sensitivity and accuracy.
The Atlas V system is an OCD and thin film metrology tool for high volume manufacturing, enabling FinFET & Gate-All-Around (GAA) logic, DRAM, and 3D NAND device process control.
The Atlas III+ system provides dependable OCD and thin film metrology for established technologies, with flexible performance across a wide range of process layers and device types.
The Iris S system is a versatile platform solution for the advanced packaging and specialty market, supporting 150mm, 200mm and 300mm wafers. It provides thin and thick film, OCD and wafer bow and film stress measurements.
The Iris G2 system is an advanced optical metrology tool for both common and critical thin films for advanced node, mature and specialty devices, enabling manufacturers to increase transistor speed, reduce power consumption and improve reliability.
A suite of OCD modeling software and computing hardware that enables the full capability and connectivity across all Onto OCD and thin film metrology systems, including Atlas, Aspect, Iris and IMPULSE systems.
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The NSX 330 system offers advanced macro inspection for a wide range of defect sizes at high throughput, with optional 3D metrology integration.
The NSX 330 system features robust platform technology with high-acceleration staging, high-speed multi-processor computing and flexible software. With over 1,000 installation worldwide, the NSX 330 System offers 2D inspection and metrology at high throughput and a broad portfolio of 3D sensors supporting critical advanced packaging applications. These include wafer-level metrology for micro bumps, RDL, kerf, overlay, and through silicon via (TSV) in a single wafer load.
Accommodating wafers from 100mm to 330mm, the system features a versatile objective turret, programmable light tower, and multiple dark field illumination modes. Additional features include resolution flexibility, unique handling solutions, and comprehensive software for recipe sharing and offline analysis. The NSX 330 system, with optional edge and backside inspection via the EB40 module, provides a comprehensive all-surface inspection solution packaging technology challenges.
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The F30 system is designed to blur the lines between dark field micro inspection and traditional macro inspection, providing automated defect inspection for front-end and outgoing quality (OQA) applications.
The F30 automated defect inspection system combines high resolution and throughput to drive fab yield and productivity. A five-objective turret enables resolution-throughput flexibility, while its multi-channel illumination including brightfield, darkfield, high-angle ring light, and IR-Review addresses the requirements for today’s multi-process inspection applications. Equipped with an advanced productivity suite (waferless recipe creation, simultaneous FOUP, recipe server and tool matching), the F30 System redefines inspection cost of ownership expectations. The system can handle 100mm – 300mm wafers can be paired with the edge and backside module (EB40) to provide an all-surface inspection solution.
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The Celero PL system is designed for subsurface defect inspection and classification for silicon carbide (SiC) and gallium nitride (GaN) based wafers and compound semiconductor materials.
The Celero PL system utilizes a laser-based phase detection and imaging capability that leverages custom optics and image processing algorithms to enable best in class throughput and sensitivity for silicon carbide and gallium nitride-based materials on 100mm to 300mm wafer sizes. Leveraging multiple light sources and sensor channels, the system can detect, measure and image a broad variety of subsurface crystalline defects, associated with bulk wafers and epitaxial layers, surface particles, scratches, pits, surface contamination, stains, point or bulk wafer stress, voids/inclusions, including chips and cracks at the edge of the wafer.
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The PrimaScan P System provides all-surface defect and contamination inspection with imaging capability for glass panel substrates.
As panel-level-packaging (PLP) transition from copper-clad laminates (CCL) to glass, the industry must adapt to ensure starting substrates are free of killer defects and contamination or latent defects that may result in yield loss or scrapped panels at later stages in the process flow. The PrimaScan P system is specifically designed to address incoming glass panel quality control for both the advanced IC substrate (AICS) and fan-out panel level processing (FOPLP) segments.
The PrimaScan P system delivers unique laser-based scanning and imaging via proprietary optics and sensing technologies for the reliable inspection of nanometer sized defects for either R&D or high-volume manufacturing environments. Utilizing multiple channel inspection technologies, the system can detect, measure and image surface particles, scratches, pits, surface contamination, stains, film or bulk panel stress, voids/inclusions, including chips and cracks at the edge of the panel.
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The PrimaScan R&D System is a stand-alone, manual load version of the PrimaScan automated wafer defect and contamination inspection system that has been specifically designed with R&D and lab environments in mind.
The PrimaScan R&D system offers a smaller spot size and higher pixel resolution than its high volume production counterpart tools. The flexibility in sample handling options combined with the multiple sensing channels and higher resolution imaging makes this the ideal tool for R&D and lab environments. Similar to the other tools in the PrimaScan line, the PrimaScan R&D system offers reliable inspection of nanometer sized defects on a variety of opaque and transparent/semi-transparent substrates and samples suitable for either R&D or lab environments. The system can detect, measure, characterize and image surface particles, scratches, pits, bumps, surface contamination, film or bulk wafer stress, voids/inclusions, including chips and cracks at the wafer edge.
Designed with versatility in mind the PrimaScan R&D system can handle a variety of wafer sizes and substrate types including film frame, photomask and sample tray.
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