As the semiconductor industry relentlessly pursues density and power scaling, more and more high aspect ratio (HAR) processes are used across multiple device segments, especially in advanced memory such as 3D NAND and 3D DRAM. The Aspect metrology system was designed with these ongoing architectures and scaling strategies in mind. Aspect metrology has demonstrated superior performance across multiple customer devices through a unique proprietary IRCD system that provides full profiling capability to enable critical process control, with the speed and process coverage that customers require.

The Aspect system is powered by a software analysis engine, Ai Diffract™, that provides up to 90% faster time to solution which extends the industry leading NanoDiffract^® software by leveraging extensive machine learning capabilities along with high fidelity modeling. The result is a simultaneous improvement in metrology performance along with a significant time to solution reduction.

The NovusEdge G2 System provides high sensitivity inspection for the edge and backside of unpatterned wafers for current and advanced nodes. Configurable modules on the same automation platform increase throughput while maintaining a small footprint for improved cost of ownership. The edge-gripping handling solution for both automation platform and the inspection modules provide desired cleanliness required for manufacturing. Optional high-sensitivity notch inspection can be added. Defects are automatically classified and binned at run time to reduce manual review.

Designed as a multipurpose inspection and sorting system for end of line outgoing quality inspection of 300mm unpatterned wafers, the system identifies, inspects and sorts wafers according to recipes.

The NovusEdge G2 system offers higher sensitivity than the previous generation, with sub-micron resolution and increased throughput by over 15%. User interaction is simplified, and the new electrical design consumes less power.