Podcast posted on Sep 12, 2024

Addressing The Challenges of Metrology for Advanced Packaging

from 3D InCites

In this episode, Françoise von Trapp talks with Onto Innovation’s Monita Pau and Jiangtao Hu about metrology for advanced packaging – why do we need it? What are the challenges, and how do we solve them? 

 
 In semiconductor manufacturing front-end processes, metrology has always been a critical step to ensure consistency of very fine features. It’s only recently become important to back-end advanced packaging processes – especially for heterogeneous integration. As chips are designed with smaller features, advanced packaging processes are becoming more front-end like. 

You’ll learn about how metrology designed for front-end manufacturing is being reimagined for wafer-level and assembly applications such as:

The speakers discuss the challenges, gaps, and solutions for each. You’ll also learn what makes Onto Innovation uniquely qualified to support this.