IVS 280 System
Overlay, CD and height metrology for 100mm-200mm wafers in the compound semiconductor, power devices, RF, MEMS and LED markets.
IVS 380 System
The IVS 380 System delivers overlay, CD and z-height metrology for advanced packaging, power, compound semi and MEMS, offering world class performance and flexibility to accommodate substrates of different sizes and thickness without hardware changes.
Product Overview
The IVS 380 is an optical overlay, CD & z-height metrology system designed for high volume manufacturing, with SMIF (200mm substrate) or FOUP (300mm substrate) load ports compatibility. It handles various substrates for advanced packaging, including Si, glass and CCL, and accommodates sizes of 200mm and 300mm.
Building on the IVS family’s 40 years of experience in CMOS, MEMS and compound semiconductor applications, the IVS 380 system possesses the versatility to tackle overlay, CD and z-height measurements for diverse substrates and layers. It measures critical dimensions in the xy plane and the vertical z-heights of features like RDL metal lines, posts and bumps. The optics enable focus on mostly transparent materials such as photoresists and rough surfaces such as electroplated copper.
Applications
- Critical Dimension
- On Product Overlay
- Specialty
Featured Markets
3D Demo
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Do you have an IVS 380 system question? Let’s talk!
As your partner for innovative solutions, we’re always here for you.
Discover how our cutting-edge semiconductor solutions are engineered to meet your most complex challenges: delivering performance, reliability and innovation where it matters most.
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IVS 280 System
The IVS 280 system delivers overlay, CD and z-height metrology for 100mm-200mm wafers. It is designed to meet the challenging requirements of power, compound semi and MEMS segments.
Product Overview
The IVS 280 system has been designed for ultimate precision, tool induced shift (TIS) and throughput for 100mm to 200mm wafers, with a mean time between failure (MTBF) > 2,000 hours. The IVS 280 system provides the same capability in a system designed for overhead track handling with full capability per SEMI® standards.
Flexibility is key in compound semiconductor processes, accommodating various wafer sizes, thicknesses, and compositions, including versatile wafer handling for Si, SiC, quartz, glass, GaAs, GaN, and LiNO3 wafers.
Its robust wafer handling and navigation system requires no operator assistance during recipe execution. The IVS 280 system enables wafer size changes without hardware alterations. Recipes and data remain stable over time. The system also supports recipe transfers from older IVS platforms like the IVS 200 and IVS 220.
The demonstrated capabilities of the IVS system to perform with high precision and solid reliability set this system apart.
Applications
- Critical Dimension
- On Product Overlay
- Z-Height
Featured Markets
3D Demo
Enter your information below and we’ll send you a unique passcode to view our IVS 3D Demo.
IVS 380 System
Overlay, CD and height metrology for 300mm wafers in the advanced packaging, compound semiconductor, power devices, RF, MEMS and LED markets.
CD Step Application in Edge Air Layer Structure Measurement for Bulk Acoustic Resonator
Do you have an IVS 280 question? Let’s talk!
As your partner for innovative solutions, we’re always here for you.
Discover how our cutting-edge semiconductor solutions are engineered to meet your most complex challenges: delivering performance, reliability and innovation where it matters most.
Let’s Talk
"*" indicates required fields