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Inspection
Automated, high-speed inspection and actionable data analysis for both unpatterned and patterned wafers and panels.
Metrology
Advanced Optical Critical Dimension (OCD) and Film metrology products to help ensure accuracy and repeatability for semiconductor manufacturers worldwide.
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Advanced packaging steppers designed to tackle manufacturing challenges, maximizing throughput while ensuring high resolution and precise overlay
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Empowering digital transformation in semiconductor manufacturing, Onto software connects data for competitive advantage and industry 4.0 success.
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Dedicated to panel-level packaging (PLP) innovations enabling 2.5D, FOPLP, 3D chiplet architectures, and AI packages for both glass and organic substrates (CCL)
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Spotlight
clear advantage
A Clear Advantage: Precision Glass Carrier Inspection for AI and HPC Markets

If you’ve been following the evolution of advanced packaging, you know that the industry is pushing boundaries like never before. From high-performance computing to industry-upending AI devices, the demand for smaller, faster, and more powerful chips is driving innovation at every level.

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semichina-19
SEMICON China

Mar 25 — Mar 27, 2026

Onto Innovation is a proud exhibitor at SEMICON China

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Onto Innovation Launches Dragonfly® G5 Inspection System
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Spotlight
clear advantage
A Clear Advantage: Precision Glass Carrier Inspection for AI and HPC Markets
Company
Upcoming Events
semichina-19
SEMICON China

Advanced Metrology for Backside Metallization Using Picosecond Laser Ultrasonics

Mar 22 — Mar 24, 2026
Conference of Science & Technology for Integrated Circuits-CSTIC
Shanghai, China

Event Details

Event: SEMICON China
Date Mar 22 — Mar 24, 2026
Location Shanghai, China
Event Conference of Science & Technology for Integrated Circuits-CSTIC
Presenters

Johnny Dai

Johnny Dai is a Principal Applications Scientist at Onto Innovation. He has been with Onto (previously Rudolph Technologies) for more than 20 years, and he holds a Ph. D in Applied Physics from Fudan University.