Abstract
Heterogeneous integration packaging is gaining rapid adoption to meet the performance demands of advanced applications such as artificial intelligence (AI) and high‑performance computing (HPC). Glass core substrates are emerging as a promising solution due to their superior mechanical stability and ability to support high‑density electrical and optical interconnects. However, the brittle nature of glass introduces significant manufacturing challenges, requiring stringent process control throughout fabrication to ensure high yield and reliability.
This presentation introduces a high‑throughput, multifunctional in‑line inspection and metrology solution applied from through‑glass via (TGV) formation through the entire buildup process. The system enables 100% panel inspection for real‑time monitoring of critical dimensions (CD), detection of missing or abnormal TGVs, and early identification of microcracks before and after metallization. During buildup, the same platform supports defect and CD monitoring of patterned traces, 3D measurement of RDL and bump height, and panel warpage analysis.
By providing real‑time process feedback and scalable coverage for panel sizes up to 650 mm × 650 mm, this integrated inspection solution is essential to enabling high‑volume manufacturing of glass core substrates and accelerating their transition from R&D to production.
Event Details
| Date | Apr 16 — Apr 16, 2026 |
|---|---|
| Location | Hiroshima, Japan |
| Event | International Conference on Electronics Packaging (ICEP) |
| Presenters |
