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surge part 2_1
The Specialty Device Surge Part 2: The Process Control Challenges of MEMS, Co-Packaged Optics, and More

In a world where high-bandwidth memory, GPUs, and advanced AI packages are all the rage, it is easy to forget the important role specialty devices play.

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Spotlight
surge part 2_1
The Specialty Device Surge Part 2: The Process Control Challenges of MEMS, Co-Packaged Optics, and More
Company
Upcoming Events
Kuala-Lumpur-day
SEMICON Southeast Asia

Process Control Innovations for Glass in Advanced Packaging

Apr 14 — Apr 18, 2026
International Conference on Electronics Packaging (ICEP)
Hiroshima, Japan

Event Details

Date Apr 14 — Apr 18, 2026
Location Hiroshima, Japan
Event International Conference on Electronics Packaging (ICEP)
Presenters

Monita Pau