Atlas® G6 System
Leading edge OCD and thin film metrology for next-generation AI applications and beyond.
Metrology
Advanced optical critical dimension (OCD) and film metrology products to help ensure accuracy and repeatability for semiconductor manufacturers worldwide
As semiconductor chips become increasingly complex, the demand for precision dimensional and films metrology intensifies.
Traditionally vital for semiconductor logic and memory markets, advanced metrology is seeing expanded adoption in next-generation advanced packaging technologies and specialty applications as these segments continue to grow in value and become increasingly sophisticated.
Our comprehensive metrology solutions include OCD, films, overlay and composition metrology. These tools are crucial for detecting process excursions in high volume manufacturing and are instrumental in R&D for helping to develop the newest devices. We offer integrated and inline metrology solutions, powered by Onto Innovation’s AI-guided modeling and analysis software, to ensure high accuracy in-line optical metrology and efficient offline recipe development.
Iris™ G2 System
A high throughput common and critical thin film optical system for advanced and mature node devices.
IMPULSE® V System
Advanced high throughput integrated metrology system with AI-driven machine learning option. The system offers maximum sensitivity and accuracy to CMP process excursions and enables process engineers to establish APC control with high-accuracy feedback.
IVS 380 System
Overlay, CD and height metrology for 300mm wafers in the advanced packaging, compound semiconductor, power devices, RF, MEMS and LED markets.
Atlas® V System
High performance OCD and thin film metrology for advanced GAA and memory devices.
Echo™ System
Opto-acoustic film metrology for in-line, non-contact, non-destructive single and multi-layer metal film thickness measurements and material characterization on 150, 200, and 300mm substrates.
Element™ G2 System
Transmission and reflection combined FTIR measurement for advanced epi thickness, film composition control and advanced IR modeling.
Aspect® System
Advanced infrared optical critical dimension (IRCD) metrology system for high aspect ratio structures in 3D NAND, 2D & 3D DRAM, CIS and power devices.
Iris™ S System
All-in-one solution for film metrology, OCD and stress measurements, tailored for advanced packaging and specialty segments.
Element™ S System
Transmission and reflection combined FTIR Measurement for wafer, specialty devices, supporting 100-200mm wafer sizes.
IVS 280 System
Overlay, CD and height metrology for 100mm-200mm wafers in the compound semiconductor, power devices, RF, MEMS and LED markets.
OCD Solutions
A suite of OCD modeling software and computing hardware offering comprehensive capabilities for inline metrology, offline recipe creation and fleet management.
IMPULSE®+ System
Integrated metrology system offering maximum sensitivity and accuracy to CMP process excursions and enabling process engineers to establish APC control with high-accuracy feedback.
Atlas® III+ System
Versatile OCD and thin film metrology for mature and mainstream nodes.
Through the Glass: Why the Rapid Development of TGV Demands Rigorous Analysis
Interconnect Innovations in High Bandwidth Memory, Part 1
Enhancing CMP Process Control with Intelligent Line Monitoring & Integrated Metrology
Bridging Performance and Yield: The Evolving Role of Interconnect Technologies in HBM
Comprehensive Process Control Solutions for Through Glass Vias
Enabling In-Line Process Control for Hybrid Bonding Applications
Using Picosecond Ultrasonic Technology for AI Packages, Part 2
Front-End Technologies Are The New Back-End Tools: Using Picosecond Ultrasonics Technology For AI Packages, Part 1
CD Step Application in Edge Air Layer Structure Measurement for Bulk Acoustic Resonator
Picosecond Ultrasonics: An Advanced Technology Utilized for Process Control of SiCr Thin Film Resistors
Advanced Interconnect Process Control with Picosecond Ultrasonic Technology for AI Device Packaging
Applications of Picosecond Laser Acoustics for Advanced Packaging
Measuring Multi-Layer Ultra-Thin Critical Films
Optical Critical Dimension Metrology with Spectroscopic Ellipsometry
Addressing The Challenges of Metrology for Advanced Packaging
Using 2D/3D Technology to Overcome Challenges of Large-Area Panel Inspection and Metrology
Using Picosecond Ultrasonics To Measure Trench Structures In SiC Power Devices
Non-destructive Measurement of Bottom Width in Deep Trench Isolation Structures Using IRCD Metrology
Non-destructive Metrology Techniques for Measuring Hole Profile in DRAM Storage Node
Advanced FTIR Optical Modeling for Hydrogen Content Measurements in 3D NAND Cell Nitride and Amorphous Carbon Hard Mask
Using OCD To Measure Trench Structures in SiC Power Devices
Using FTIR To Improve SiC Power Device Performance
Changing Shop Floor Metrology From a Cost to a Benefit
The Road to SiC Process Control
Optimizing Metal Film Measurement on IGBT And MOSFET Power Devices with Picosecond Ultrasonic Technology
3D NAND Needs 3D Metrology
Measuring the Critical W-recess in 3D NAND
The Age of Hybrid Bonding: Where We Are and Where We’re Going
A Star is Born: Gallium nitride and the coming age of compound semiconductors
Efficient pump-probe sampling with a single-cavity dual-comb laser: Application in ultrafast photoacoustics
Metrology Sampling Plans Are Key For Device Analytics And Traceability
Paving the Way for 5G: RF Filter Process Monitoring and Control Using Picosecond Ultrasonic Metrology
Critical Moves: Advanced Logic Devices And CIS Benefit From Applications Using IRCD Metrology
Advanced Modeling In FTIR Offers New Applications For HVM
Optical Critical Dimension Metrology for Semiconductor Manufacturing
Reducing Rework In CMP: An Enhanced Machine Learning-Based Hybrid Metrology Approach
Expanded Material Metrology For Refined Etch Selectivities
Imaging of Overlay and Alignment Markers Under Opaque Layers Using Picosecond Laser Acoustic Measurements
Mid-Infrared Optical Metrology for High Aspect Ratio Holes in 3D NAND Memory Manufacturing
Advantages of Picosecond Ultrasonic Technology for Advanced RF Metrology
Untangling 3D NAND: Tilt, Registration, and Misalignment
Metrology Solutions for Gate-All-Around Transistors in High Volume Manufacturing
Monitoring Critical Process Steps in 3D NAND using Picosecond Ultrasonic Metrology with both Thickness and Sound Velocity Capabilities
Full Metrology Solutions for Advanced RF with Picosecond Ultrasonic Metrology
Artificial Intelligence and Machine Learning in Semiconductor Manufacturing: Inspection and Metrology
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