JetStep® X300 System

The JetStep X300 is designed and engineered for the most challenging advanced packaging applications

Product Overview

As resolution, overlay and other critical lithography specifications become tighter and more sophisticated for advanced packaging processes, fulfilling lithography requirements becomes a challenge. Onto Innovation's JetStep X300 System has been specifically designed to meet advance packaging challenges with the largest field size in the industry and application-specific options including submicron projection lens, warped wafer handling, on-the-fly optical focus, wafer edge processing and backside alignment. Now, the system has a 30% smaller footprint and is 25% faster than the previous generation.

JetStep X300
JetStep X300



  • High-fidelity projection lens and illumination system delivers the largest process window for 2µm and 1µm resolutions
  • User-selectable wavelength settings
  • Automatic compensation of die shift for superior registration to zero layer
  • Backside alignment 
  • 6 inch square reticle format enables cost efficient reticle and lower COO

  • 6 degrees of freedom reticle chuck with automated magnification adjustment for precise layer to layer registration
  • Automated reticle handling and storage system with fast reticle exchange to maximize throughput
  • Fully programmable and flexible pattern recognition alignment system
  • Real time “on the fly” autofocus at every exposure site to automatically adjust focus over topology
  • Environmental management system to mitigate fab contamination

You Have
a Challenge? We Love
a Challenge.

Let's Talk