Firefly® Series

The Firefly inspection series provides an automated inspection solution for high performance applications like FPGA, CPU/GPU and networking servers in addition to applications with low I/O counts: IC drivers, RF transceivers, wireless connectivity and MEMS.

Product Overview

The platform, configurable for either wafer (round) or panel (rectangular) substrates, offers multiple imaging modes, including Onto Innovation’s patented Clearfind® Technology, a technique for enabling a large process window to detect residue defects on metal and metal defects on organic layers. The combination of substrate flexibility, defect sensitivity and metrology in a single platform reduces capital investment requirements and provides a reliable pathway to transition from wafer to panel-based processes for applications requiring high I/O counts and multiple-chip integration, such as SoC with memory, wireless module and wide I/O memory.

Integration with Onto Innovation’s Discover Defect software quickly turns defect data into actionable process control, improves classification and reduces manual review. It enables our customers to develop, learn and analyze new processes reliably while significantly improving their product delivery time to market.

Sub-nm PI film residue detection: comparing SEM image to Clearfind Technology image
Sub-nm PI film residue detection: comparing SEM image to Clearfind Technology image



  • Sub-micron sensitivity in bright field and dark field applications through advanced algorithms
  • On-the-fly focus systems for high resolution inspection
  • Round wafer (100mm-330mm) and rectangular substrate (up to 515mm x 515mm) support
  • LED and Laser illumination modes to capture the widest range of defect types
  • Improved capture rate and reduced nuisance rate using Clearfind technology
  • Integrated metrology for overlay and critical dimension measurements
  • On-the-fly segmentation and CAD-based design rules algorithm

  • Wide format camera sensor enables high throughput
  • Waferless recipe creation using automated alignment and CAD import
  • High warpage handling solution
  • Tool matching and recipe sharing with common recipe server
  • Automated binning and classification by defect type
  • Online and offline color review for defect verification

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