Combining edge and backside inspection into one module
The Class 1 certified E30 and B30 modules (available separately or combined in one module) can automatically detect defects on the entire edge, from zone 1 to 5, and the entire backside. The ability to inspect the entire backside allows for faster root-cause analysis of zone 5 defects since such defects can migrate from the wafer interior.
The EB30 module captures defect images on the fly, creates whole-wafer composite images, and is fully integrated for SEM bevel review. All inspection and metrology results, including defect, whole wafer and SEM images can be analyzed together in a single database using our Discover Defect software analysis package. Correlating EBR metrology with all-surface defectivity data, SEM data and micro-inspection results is only the beginning of what Discover software can do. In addition to the advanced on-tool defect binning, real-time edge ADC classification can be assigned to defects prior to manual offline review using Discover Review software.
Advanced macro inspection for front-end manufacturers
2D automated defect inspection and sample 3D inspection for advanced packaging
Inline yield and defect management
Offline defect review and manual classification software