Aspect S System
Advanced model-based infrared reflectometry (MBIR) metrology system for in-line monitoring of 3D structures used in V-NAND, CIS and power devices, as well as carbon hardmasks, dielectric compositions and epitaxial layer stacks.
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FAaST® Digital SPV System
The FAaST Digital Surface PhotoVoltage (SPV) system delivers leading sensitivity for silicon wafer contamination control, rapidly mapping minority carrier diffusion length and detecting economically impactful iron (Fe) in minutes.
CnCV® System
The CnCV (corona non-contact capacitance voltage) system is a powerful non-contact electrical metrology platform for dopant profiling and electrical defect mapping in wide bandgap (WBG) semiconductors.
Office Location Billerica
Office Location Florida
