The advanced packaging and specialty semiconductor markets face several high-value challenges. For advanced packaging, the focus is on inspecting fine-pitch RDL and micro-bumps. For the CIS (CMOS) market, a primary concern is on low-contrast defect detection, while wafer dicing requires flawless crack inspection following the sawing process. As a result, surface inspection is more important than ever to ensure device quality and reliability. The next-generation of inspection and metrology platforms will need to improve sensitivity and throughput in order to become a best-in-class cost-of-ownership solution in the market. An inspection platform with 2D inspection and 3D metrology capabilities and sub-micron resolution can scan 2D more than 30% faster and 3D more than 50% faster than previous systems.