Jun 3 — Jun 30, 2020 Online

Adaptive Shot Technology To Address Severe Lithography Challenges For Advanced FOPLP

John Chang

Presentation at 70th Electronic Components and Technology Conference (ECTC)
8:00am — 6:37pm
ECTC 2020 has moved to a virtual platform. The virtual conference will be free to all attendees with pre-recorded speeches available from June 3 to June 30. 



Fan-out wafer level packaging (FOWLP) is a popular new packaging technology that allows the user to increase I/O in a smaller IC size than fan-in wafer level packaging. Market drivers such as 5G, IoT, Mobile and AI will all use this technology. According to Yole analysis, fan-out packaging market size will increase to $3 billion in 2022 from $2.44 hundred million in 2014, validating the market requirement for fan out packaging. While FOWLP has been used for many years, there is still a relentless drive to reduce the cost, and Fan-Out Panel Level Packaging (FOPLP) has been proposed as one possible solution. FOPLP allows users to put more chips on a substrate, meaning more product output and a higher substrate utilization percentage. According Yole’s analysis, FOPLP market size will increase to $2.79 hundred million with 79% CAGR, showing that more people are adopting FOPLP.

FOPLP has many advantages and low cost potential, but it faces significant process challenges, such as die placement error and substrate warpage control. One of the key challenges is the trade-off between overlay, yield, and throughput during the lithography processing steps. A user exposes multiple dies per exposure shot to increase throughput, but this can result in lower overlay yield because of “pick and place” die placement error. To overcome the low yield issue, each die needs to be aligned, but this impacts throughput, so a compromise is required. To find the “balance point” between throughput and overlay is one of the biggest challenges for FOPLP.

In this paper we address the tradeoff between throughput and overlay yield, we demonstrate an integrated feed forward adaptive shot solution. This feed forward approach uses a third party metrology system to measure reconstituted panel die location data and sends the data to the stepper via a network. With feed forward algorithm technology, the stepper uses smart adaptive shot technology to generate an optimized variable shot size layout. This layout ensures the overlay yield is within specification with the minimum number of exposure steps. With feed forward adaptive shot technology, the user can maximize the throughput of the stepper and ensure the overlay yield at the same time.