May 10 — May 12, 2021 Virtual

Fab Fingerprint for Proactive Yield Management

Prasad Bachiraju

Prasad Bachiraju

Presentation at Advanced Semiconductor Manufacturing Conference (ASMC)
10:00am — 6:00pm

The proposed paper will present a case study describing how to improve yield and fab productivity by implementing a frequent pattern database that utilizes Artificial Intelligence based Spatial Pattern Recognition (SPR) results and wafer process history. This is important because associating spatial yield issues with process and tools is often performed as a reactive analysis, resulting in increased wafer scrap or die loss that could be prevented. The implementation of fab fingerprint technology proactively generates a pareto of high impacting process steps and tools based on a pattern score enabling the production team to concentrate more efficiently on yield limiting events.